The powerful EndyMed is a versatile system that can help address a broad range of concerns. It can be used for body contouring and skin tightening, as well as fractional skin resurfacing for problems such as acne scars, stretch marks, and wrinkles. Dr. Day and her associates will use the FDA approved EndyMed machine to deliver powerful energy through the 3DEEP RF technology to give you smoother, tighter, younger looking skin. Since EndyMed is such a versatile system, each treatment will be personally tailored to you and your unique skin quality in order to deliver the most beautiful results possible.
The EndyMed system treatments can be broken down into two broad categories:
If you are looking to smooth and tighten the skin on your neck, lower jaw, upper arms, chest or knees, EndyMed Skin Tightening could be the perfect treatment for you. Whether performed on the face or other parts of the body, EndyMed skin tightening relies on the same 3DEEP technology that deeply heats collagen fibers. The thermal energy targets the sub-dermal layer of the skin in order to stimulate the body’s natural healing process and stimulate the collagen to rebuild, hence giving a firmer, tighter appearance in the area.
If you are looking to experience a new level of dermal skin remodeling, EndyMed’s latest microneedling treatment handpiece can give you smoother and more youthful skin that can last up to a year after your final treatment session. EndyMed Intensif uses a shock-free needle-insertion mechanism to warm the skin and stimulate collagen. EndyMed Intensif Microneedling is particularly effective on acne scars, wrinkles, stretch marks, and dilated pores.
If you are looking for a comfortable, effective, proven way to improve the look of fine lines, wrinkles, or cellulite, ask Dr. Day about the EndyMed system at your next visit! Whether it is through skin tightening or resurfacing, the EndyMed device can deliver remarkable rejuvenation.
"Endymed Intensif has helped so much with my acne scars and I'm much more confident now!" - Olson, C